Technology

TSMC has doubled its CoWoS advanced packaging capacity annually for three consecutive years, now operating 10 dedicated facilities, yet a supply shortfall of roughly 20 percent persisted as of mid-2026. Analysts project the gap will narrow to around 10 percent by year-end 2026 and ease further into 2027, supported by expansion at TSMC's Chiayi and Arizona sites alongside OSAT partners ASE and Amkor. TSMC's only publicly disclosed capacity metric is an internal forecast of more than 80 percent compound annual growth from 2022 to 2027; specific wafer-per-month figures cited widely in industry coverage originate with outside analysts, not the company itself.

Samsung Foundry publicly confirmed at the NGL 2026 conference that its SF1.4 (1.4nm-class) node will reach mass production in 2029, two years later than its 2024 roadmap indicated, with the intervening period dedicated to expanding the SF2 family to improve yields and commercial viability. Samsung also made its first public commitment on High-NA EUV, stating the technology will not enter production until its SF1A (1nm-class) generation around 2030, citing high technical difficulty and equipment cost as reasons for deferral. As of the announcement, no publicly confirmed customer design wins for the SF1.4 node exist, while Tesla and Qualcomm are the only traceable customers tied to the earlier SF2 family.