SK Hynix Breaks Ground on $4 Billion Indiana HBM Packaging Facility Targeting 2029 Production
SK Hynix held a groundbreaking ceremony on August 27, 2026, for a back-end HBM packaging facility in West Lafayette, Indiana, representing more than $4 billion in investment and targeting volume production of next-generation HBM by the second half of 2029. The facility will package wafers fabricated in South Korea rather than manufacture them domestically, a distinction that leaves the company's 'Made in USA' product claims unresolved pending a formal U.S. Customs and Border Protection origin determination. Federal CHIPS Act funding of up to $458 million in direct grants and $500 million in loans is milestone-based and not yet fully disbursed, and several construction permits remain pending.