Samsung and Broadcom Sign Non-Binding MOU Estimating $200 Billion in AI Chip Cooperation Through 2030
Samsung and Broadcom signed a memorandum of understanding on July 25, 2026, covering HBM supply, 2nm and sub-2nm foundry manufacturing, and advanced packaging for AI accelerators — but the $200 billion figure is Samsung's own estimate of potential value, not a contracted revenue commitment. No binding purchase agreements or public financial filings have been located, and a South Korean government official described the deals as conditional advance orders contingent on production. The MOU is one piece of a broader $950 billion package of non-binding semiconductor cooperation agreements announced during South Korean President Lee Jae Myung's U.S. visit.