Supply Chain Sources Estimate TSMC 3nm Output at 210,000 Wafers Monthly by Mid-2027
Industry sources cited by Seoul Economic Daily and TrendForce project TSMC's 3nm wafer output will reach roughly 210,000 units per month by mid-2027, up from an estimated 120,000 to 130,000 at end-2025, while CoWoS advanced packaging capacity is estimated to double to 260,000 wafers monthly by end-2028. These figures are supply-chain estimates, not official TSMC guidance; the company has confirmed a raised 2026 capital budget of $60 to $64 billion and a $100 billion Arizona expansion but has not published node-level capacity targets. Decision-makers tracking AI chip supply should weigh the distinction between third-party projections and what TSMC has formally disclosed.