Samsung Reportedly Plans TSMC Base Die Sourcing for Custom HBM4E Alongside Internal Foundry
Industry reports from ZDNet Korea and DIGITIMES indicate Samsung is considering a dual-sourcing model for custom HBM base dies, pairing its own DRAM core dies with base dies manufactured at either Samsung Foundry or TSMC depending on customer requirements, with NVIDIA's NVHBM specification cited as the likely application starting at HBM4E. Samsung's official record confirms only that its internal 4nm foundry process is currently producing base dies for HBM4 and HBM4E, contributing measurably to Foundry earnings in Q2 2026. The TSMC arrangement remains unconfirmed by either company, with no process node, contract terms, production volumes, or qualification status established in the available evidence.